John R. Schlup
About
John R. Schlup has authored 35 papers that have received a total of 1.0k indexed citations.
This includes 11 papers in Materials Chemistry, 9 papers in Mechanical Engineering and 7 papers in Organic Chemistry. The topics of these papers are Epoxy Resin Curing Processes (9 papers), Thermal and Kinetic Analysis (4 papers) and Photopolymerization techniques and applications (4 papers). John R. Schlup is often cited by papers focused on Epoxy Resin Curing Processes (9 papers), Thermal and Kinetic Analysis (4 papers) and Photopolymerization techniques and applications (4 papers) and collaborates with scholars based in United States, China and The Netherlands. John R. Schlup's co-authors include Jishu Shi, Honghui Xu, Kenneth J. Klabunde, L. T. Fan and Keith L. Hohn and has published in prestigious journals such as Journal of the American Chemical Society, Journal of Applied Physics and Chemistry of Materials.
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