John E. Sanchez
About
John E. Sanchez has authored 65 papers that have received a total of 1.2k indexed citations.
This includes 46 papers in Electronic, Optical and Magnetic Materials, 35 papers in Electrical and Electronic Engineering and 19 papers in Materials Chemistry. The topics of these papers are Copper Interconnects and Reliability (39 papers), Electronic Packaging and Soldering Technologies (19 papers) and Metal and Thin Film Mechanics (17 papers). John E. Sanchez is often cited by papers focused on Copper Interconnects and Reliability (39 papers), Electronic Packaging and Soldering Technologies (19 papers) and Metal and Thin Film Mechanics (17 papers) and collaborates with scholars based in United States, Germany and Mexico. John E. Sanchez's co-authors include Eduard Arzt, Paul R. Besser, Arturo Ponce, Oliver Kraft and Miguel José‐Yacamán and has published in prestigious journals such as Nano Letters, Applied Physics Letters and Journal of Applied Physics.
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