Jiaqi Wu

25 papers and 309 indexed citations i.

Jiaqi Wu has authored 25 papers that have received a total of 309 indexed citations. This includes 18 papers in Electrical and Electronic Engineering, 10 papers in Materials Chemistry and 5 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (5 papers) and Aluminum Alloys Composites Properties (5 papers). Jiaqi Wu is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (5 papers) and Aluminum Alloys Composites Properties (5 papers) and collaborates with scholars based in China, United States and Australia. Jiaqi Wu's co-authors include Chin C. Lee, Jian‐Mei Lu, Fushan Li, Xiuchen Zhao and Li‐Xiong Shao and has published in prestigious journals such as Journal of The Electrochemical Society, The Journal of Organic Chemistry and Chemistry - A European Journal.