Jian Cai
About
Jian Cai has authored 74 papers that have received a total of 1.7k indexed citations.
This includes 58 papers in Electrical and Electronic Engineering, 14 papers in Electronic, Optical and Magnetic Materials and 12 papers in Materials Chemistry. The topics of these papers are 3D IC and TSV technologies (29 papers), Electronic Packaging and Soldering Technologies (26 papers) and Plasmonics for Photovoltaic Devices (9 papers). Jian Cai is often cited by papers focused on 3D IC and TSV technologies (29 papers), Electronic Packaging and Soldering Technologies (26 papers) and Plasmonics for Photovoltaic Devices (9 papers) and collaborates with scholars based in China, United States and Hong Kong. Jian Cai's co-authors include Junqiang Wang, J.K.O. Sin, Liangliang Li and Dedong Han and has published in prestigious journals such as Advanced Functional Materials, Journal of The Electrochemical Society and Chemical Engineering Journal.
In The Last Decade
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