J.H.L. Pang

134 papers and 4.2k indexed citations i.

J.H.L. Pang has authored 134 papers that have received a total of 4.2k indexed citations. This includes 66 papers in Mechanical Engineering, 63 papers in Mechanics of Materials and 61 papers in Electrical and Electronic Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (55 papers), Fatigue and fracture mechanics (31 papers) and 3D IC and TSV technologies (24 papers). J.H.L. Pang is often cited by papers focused on Electronic Packaging and Soldering Technologies (55 papers), Fatigue and fracture mechanics (31 papers) and 3D IC and TSV technologies (24 papers) and collaborates with scholars based in Singapore, United States and China. J.H.L. Pang's co-authors include Luhua Xu, Xu Shi, Fa Xing, Gengzhi Sun and Hsin Jen Hoh and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Advanced Functional Materials.