Jerome A. Rejent
About
Jerome A. Rejent has authored 29 papers that have received a total of 690 indexed citations.
This includes 27 papers in Electrical and Electronic Engineering, 23 papers in Mechanical Engineering and 12 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (27 papers), Aluminum Alloy Microstructure Properties (12 papers) and Intermetallics and Advanced Alloy Properties (8 papers). Jerome A. Rejent is often cited by papers focused on Electronic Packaging and Soldering Technologies (27 papers), Aluminum Alloy Microstructure Properties (12 papers) and Intermetallics and Advanced Alloy Properties (8 papers) and collaborates with scholars based in United States. Jerome A. Rejent's co-authors include Paul T. Vianco, Alice C. Kilgo, Paul F. Hlava, Gary L. Zender and Michael K. Neilsen and has published in prestigious journals such as Journal of Materials Science, Review of Scientific Instruments and Journal of materials research/Pratt's guide to venture capital sources.
In The Last Decade
Fields of papers published by Jerome A. Rejent
Since SpecializationEngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics
Countries citing papers authored by Jerome A. Rejent
Since SpecializationCitations
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