J. K. Lin

7 papers and 499 indexed citations i.

J. K. Lin has authored 7 papers that have received a total of 499 indexed citations. This includes 7 papers in Electrical and Electronic Engineering, 6 papers in Mechanical Engineering and 1 paper in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (7 papers), Intermetallics and Advanced Alloy Properties (5 papers) and 3D IC and TSV technologies (4 papers). J. K. Lin is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), Intermetallics and Advanced Alloy Properties (5 papers) and 3D IC and TSV technologies (4 papers) and collaborates with scholars based in United States, South Korea and Finland. J. K. Lin's co-authors include D. R. Frear, Jihun Jang, J. W. Jang, Douglas C. Hopkins and K. N. Tu and has published in prestigious journals such as Applied Physics Letters, Journal of materials research/Pratt's guide to venture capital sources and JOM.