J. F. McDonald
About
J. F. McDonald has authored 134 papers that have received a total of 1.7k indexed citations.
This includes 90 papers in Electrical and Electronic Engineering, 26 papers in Biomedical Engineering and 16 papers in Hardware and Architecture. The topics of these papers are Semiconductor materials and devices (21 papers), 3D IC and TSV technologies (18 papers) and Radio Frequency Integrated Circuit Design (16 papers). J. F. McDonald is often cited by papers focused on Semiconductor materials and devices (21 papers), 3D IC and TSV technologies (18 papers) and Radio Frequency Integrated Circuit Design (16 papers) and collaborates with scholars based in United States, Canada and The Netherlands. J. F. McDonald's co-authors include G.‐R. Yang, S. Dabral, R.P. Kraft, Toh‐Ming Lu and Richard J. Caron and has published in prestigious journals such as Physical Review Letters, Journal of the American Statistical Association and Applied Physics Letters.
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