Hyoung-Joon Kim
About
Hyoung-Joon Kim has authored 13 papers that have received a total of 250 indexed citations.
This includes 11 papers in Electrical and Electronic Engineering, 3 papers in Materials Chemistry and 3 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (8 papers) and Advanced Welding Techniques Analysis (2 papers). Hyoung-Joon Kim is often cited by papers focused on Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (8 papers) and Advanced Welding Techniques Analysis (2 papers) and collaborates with scholars based in South Korea and Japan. Hyoung-Joon Kim's co-authors include Kyung‐Wook Paik, Yongjin Park, Jin Lee, Myung-Jin Yim and U‐In Chung and has published in prestigious journals such as Japanese Journal of Applied Physics, Journal of Electronic Materials and Leukemia Research.
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