Houman Zahedmanesh
About
Houman Zahedmanesh has authored 45 papers that have received a total of 630 indexed citations.
This includes 31 papers in Electrical and Electronic Engineering, 27 papers in Electronic, Optical and Magnetic Materials and 12 papers in Mechanics of Materials. The topics of these papers are Copper Interconnects and Reliability (27 papers), Semiconductor materials and devices (19 papers) and Electronic Packaging and Soldering Technologies (14 papers). Houman Zahedmanesh is often cited by papers focused on Copper Interconnects and Reliability (27 papers), Semiconductor materials and devices (19 papers) and Electronic Packaging and Soldering Technologies (14 papers) and collaborates with scholars based in Belgium, Ireland and Austria. Houman Zahedmanesh's co-authors include Kristof Croes, Caitríona Lally, Kris Vanstreels, Christoph Adelmann and Cedric Huyghebaert and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of Biomechanics.
In The Last Decade
Fields of papers published by Houman Zahedmanesh
Since SpecializationEngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics
Countries citing papers authored by Houman Zahedmanesh
Since SpecializationCitations
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