Houfu Dai

22 papers and 699 indexed citations i.

Houfu Dai has authored 22 papers that have received a total of 699 indexed citations. This includes 20 papers in Biomedical Engineering, 15 papers in Materials Chemistry and 13 papers in Mechanical Engineering. The topics of these papers are Chemical Mechanical Polishing in Microelectronics Manufacturing (20 papers), Diamond and Carbon-based Materials Research (15 papers) and Advanced machining processes and optimization (13 papers). Houfu Dai is often cited by papers focused on Chemical Mechanical Polishing in Microelectronics Manufacturing (20 papers), Diamond and Carbon-based Materials Research (15 papers) and Advanced machining processes and optimization (13 papers) and collaborates with scholars based in China and Germany. Houfu Dai's co-authors include Genyu Chen, Weilong Wu, Jianbin Chen, Ping Li and Shaobo Li and has published in prestigious journals such as Nanoscale, Applied Surface Science and RSC Advances.