Hongbin Shi

30 papers and 300 indexed citations i.

About

Hongbin Shi has authored 30 papers that have received a total of 300 indexed citations. This includes 17 papers in Electrical and Electronic Engineering, 10 papers in Mechanics of Materials and 7 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (9 papers) and Advanced ceramic materials synthesis (5 papers). Hongbin Shi is often cited by papers focused on Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (9 papers) and Advanced ceramic materials synthesis (5 papers) and collaborates with scholars based in China, Japan and United States. Hongbin Shi's co-authors include Yabing Zhang, Toshitsugu Ueda, Qing Liu and Teng Zhang and has published in prestigious journals such as Chemical Engineering Journal, Journal of the American Ceramic Society and Industrial & Engineering Chemistry Research.

In The Last Decade

Fields of papers published by Hongbin Shi

Since Specialization
EngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics

Countries citing papers authored by Hongbin Shi

Since Specialization
Citations
Rankless by CCL
2025