Gordon Elger
About
Gordon Elger has authored 64 papers that have received a total of 639 indexed citations.
This includes 39 papers in Electrical and Electronic Engineering, 13 papers in Materials Chemistry and 12 papers in Automotive Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (23 papers), 3D IC and TSV technologies (17 papers) and GaN-based semiconductor devices and materials (9 papers). Gordon Elger is often cited by papers focused on Electronic Packaging and Soldering Technologies (23 papers), 3D IC and TSV technologies (17 papers) and GaN-based semiconductor devices and materials (9 papers) and collaborates with scholars based in Germany, Italy and United Kingdom. Gordon Elger's co-authors include Fosca Conti, Christian Endisch, H. Kurreck, Lidiya Komsiyska and K. Möbius and has published in prestigious journals such as The Journal of Physical Chemistry, Physical Chemistry Chemical Physics and International Journal of Hydrogen Energy.
In The Last Decade
Fields of papers published by Gordon Elger
Since SpecializationEngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics
Countries citing papers authored by Gordon Elger
Since SpecializationCitations
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