Gaowei Xu

34 papers and 225 indexed citations i.

Gaowei Xu has authored 34 papers that have received a total of 225 indexed citations. This includes 24 papers in Electrical and Electronic Engineering, 7 papers in Biomedical Engineering and 6 papers in Mechanical Engineering. The topics of these papers are 3D IC and TSV technologies (19 papers), Electronic Packaging and Soldering Technologies (17 papers) and Copper Interconnects and Reliability (6 papers). Gaowei Xu is often cited by papers focused on 3D IC and TSV technologies (19 papers), Electronic Packaging and Soldering Technologies (17 papers) and Copper Interconnects and Reliability (6 papers) and collaborates with scholars based in China and Canada. Gaowei Xu's co-authors include Le Luo, Heng Li, Gong Cheng and Weibo Zhang and has published in prestigious journals such as Scientific Reports, Construction and Building Materials and Journal of Physics D Applied Physics.