Ehrenfried Zschech
About
Ehrenfried Zschech has authored 301 papers that have received a total of 6.5k indexed citations.
This includes 201 papers in Electrical and Electronic Engineering, 97 papers in Electronic, Optical and Magnetic Materials and 68 papers in Materials Chemistry. The topics of these papers are Copper Interconnects and Reliability (85 papers), Electronic Packaging and Soldering Technologies (76 papers) and Integrated Circuits and Semiconductor Failure Analysis (74 papers). Ehrenfried Zschech is often cited by papers focused on Copper Interconnects and Reliability (85 papers), Electronic Packaging and Soldering Technologies (76 papers) and Integrated Circuits and Semiconductor Failure Analysis (74 papers) and collaborates with scholars based in Germany, United States and Poland. Ehrenfried Zschech's co-authors include Zhongquan Liao, Xinliang Feng, Tao Zhang, M. Hecker and Renhao Dong⧫ and has published in prestigious journals such as Journal of the American Chemical Society, Angewandte Chemie International Edition and Advanced Materials.
In The Last Decade
Fields of papers published by Ehrenfried Zschech
Since SpecializationEngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics
Countries citing papers authored by Ehrenfried Zschech
Since SpecializationCitations
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