Doug C. H. Yu
About
Doug C. H. Yu has authored 9 papers that have received a total of 469 indexed citations.
This includes 8 papers in Electrical and Electronic Engineering, 2 papers in Biomedical Engineering and 1 paper in Mechanical Engineering. The topics of these papers are 3D IC and TSV technologies (5 papers), Electronic Packaging and Soldering Technologies (3 papers) and Microwave Engineering and Waveguides (2 papers). Doug C. H. Yu is often cited by papers focused on 3D IC and TSV technologies (5 papers), Electronic Packaging and Soldering Technologies (3 papers) and Microwave Engineering and Waveguides (2 papers) and collaborates with scholars based in Taiwan, United States and United Kingdom. Doug C. H. Yu's co-authors include Sheng-Yi Hsiao, Brendan Fisher, Ken‐Yu Lin, Rhys E. Green and R.S. de Groot and has published in prestigious journals such as Ecological Applications, MRS Bulletin and Journal of Electronic Materials.
In The Last Decade
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