Doosan Back
Impact in
- Mechanical Engineering top 5%
- Heat Transfer and Optimization
- Heat Transfer and Boiling Studies
- Heat Transfer Mechanisms
- Computational Mechanics top 10%
- Fluid Dynamics and Thin Films
Papers in
-
- Heat Transfer and Optimization 4
- Heat Transfer and Boiling Studies 4
- Heat Transfer Mechanisms 2
- Refrigeration and Air Conditioning Technologies 1
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- Nanomaterials and Printing Technologies 1
- Silicon Carbide Semiconductor Technologies 1
- Co-authors
- David B. Janes (7 shared papers)Dimitrios Peroulis (4 shared papers)Suresh V. Garimella (4 shared papers)Michael D. Sinanis (4 shared papers)Justin A. Weibel (4 shared papers)Kevin P. Drummond (4 shared papers)S. Jin (1 shared paper)Qiong Nian (1 shared paper)
- Journals
- International Journal of Heat and Mass Transfer (2 papers)IEEE Sensors Journal (1 paper)ACS Nano (1 paper)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)Reliability physics (1 paper)
- Partner nations
- United States
In The Last Decade
Doosan Back
7 papers receiving 655 citations
Doosan Back's Hit Papers
Peers
Comparison fields: 5 of 35
- Mechanical Engineering 527
- Computational Mechanics 97
- Renewable Energy, Sustainability and the Environment 45
- Electrical and Electronic Engineering 135
- Materials Chemistry 94
Countries citing papers authored by Doosan Back
This map shows the geographic impact of Doosan Back's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Doosan Back with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Doosan Back more than expected).
Fields of papers citing papers by Doosan Back
This network shows the impact of papers produced by Doosan Back. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Doosan Back. The network helps show where Doosan Back may publish in the future.
Co-authors
The 16 scholars most cited alongside Doosan Back, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | A hierarchical manifold microchannel heat sink array for high-heat-flux two-phase cooling of electronics Hit paper breakdown → | 2017 | 338 |
| 2 | 2018 | 144 | |
| 3 | 2015 | 66 | |
| 4 | 2019 | 62 | |
| 5 | 2016 | 36 | |
| 6 | 1984 | 19 | |
| 7 | 2020 | 5 | |
| 8 | 2014 | 0 |
About Doosan Back
Doosan Back is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering, Biomedical Engineering, Pollution and Atomic and Molecular Physics, and Optics, having authored 8 papers that have together received 670 indexed citations. Recurring topics across this work include Heat Transfer and Optimization (4 papers), Heat Transfer and Boiling Studies (4 papers), Heat Transfer Mechanisms (2 papers), Nanomaterials and Printing Technologies (1 paper), Silicon Carbide Semiconductor Technologies (1 paper), Laser-Ablation Synthesis of Nanoparticles (1 paper), Diamond and Carbon-based Materials Research (1 paper) and Refrigeration and Air Conditioning Technologies (1 paper). The work is most often cited by research in Mechanical Engineering (527 citations), Computational Mechanics (97 citations), Renewable Energy, Sustainability and the Environment (45 citations), Electrical and Electronic Engineering (135 citations) and Materials Chemistry (94 citations). Doosan Back has collaborated with scholars based in United States. Frequent co-authors include David B. Janes, Dimitrios Peroulis, Suresh V. Garimella, Michael D. Sinanis, Justin A. Weibel, Kevin P. Drummond, S. Jin, Qiong Nian, Suprem R. Das and Mojib Saei. Their work appears in journals such as International Journal of Heat and Mass Transfer, IEEE Sensors Journal, ACS Nano, IEEE Transactions on Components Packaging and Manufacturing Technology and Reliability physics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.