D.M. Hockanson
Impact in
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- Electromagnetic Compatibility and Noise Suppression
- Electromagnetic Compatibility and Measurements
- Electrostatic Discharge in Electronics
- 3D IC and TSV technologies
- Power Line Communications and Noise
- Microwave Engineering and Waveguides
- Electromagnetic Simulation and Numerical Methods
- Aerospace Engineering top 5%
- Advanced Antenna and Metasurface Technologies
Papers in
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- Electromagnetic Compatibility and Noise Suppression 20
- Electromagnetic Compatibility and Measurements 13
- Electromagnetic Simulation and Numerical Methods 7
- 3D IC and TSV technologies 4
- Electrostatic Discharge in Electronics 4
- Electronic Packaging and Soldering Technologies 2
-
- Advanced Antenna and Metasurface Technologies 9
- Co-authors
- James L. Drewniak (17 shared papers)T.H. Hubing (14 shared papers)T.P. Van Doren (11 shared papers)Fei Sha (3 shared papers)Michael J. Wilhelm (1 shared paper)Xiaoning Ye (3 shared papers)R.E. DuBroff (3 shared papers)Kuang-Ping Ma (1 shared paper)
- Journals
- IEEE Transactions on Electromagnetic Compatibility (7 papers)Electromagnetic waves (2 papers)IEEE Electromagnetic Compatibility Magazine (1 paper)
- Partner nations
- United StatesChina
In The Last Decade
D.M. Hockanson
21 papers receiving 658 citations
Peers
Comparison fields: 5 of 27
- Electrical and Electronic Engineering 686
- Aerospace Engineering 243
- Astronomy and Astrophysics 54
- Electronic, Optical and Magnetic Materials 34
- Hardware and Architecture 12
Countries citing papers authored by D.M. Hockanson
This map shows the geographic impact of D.M. Hockanson's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D.M. Hockanson with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D.M. Hockanson more than expected).
Fields of papers citing papers by D.M. Hockanson
This network shows the impact of papers produced by D.M. Hockanson. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D.M. Hockanson. The network helps show where D.M. Hockanson may publish in the future.
Co-authors
The 19 scholars most cited alongside D.M. Hockanson, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 22 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1996 | 217 | |
| 2 | 1995 | 147 | |
| 3 | 1997 | 63 | |
| 4 | 1996 | 48 | |
| 5 | 1997 | 42 | |
| 6 | 2001 | 38 | |
| 7 | 2003 | 23 | |
| 8 | 2002 | 22 | |
| 9 | 2008 | 19 | |
| 10 | 2002 | 18 | |
| 11 | 2002 | 13 | |
| 12 | 2002 | 13 | |
| 13 | 2008 | 12 | |
| 14 | 2004 | 7 | |
| 15 | 2002 | 7 | |
| 16 | 2002 | 5 | |
| 17 | 2020 | 4 | |
| 18 | 2002 | 4 | |
| 19 | 2006 | 2 | |
| 20 | 2002 | 2 |
About D.M. Hockanson
D.M. Hockanson is a scholar working on Electrical and Electronic Engineering, Aerospace Engineering, Atomic and Molecular Physics, and Optics, Astronomy and Astrophysics and Ocean Engineering, having authored 22 papers that have together received 707 indexed citations. Recurring topics across this work include Electromagnetic Compatibility and Noise Suppression (20 papers), Electromagnetic Compatibility and Measurements (13 papers), Advanced Antenna and Metasurface Technologies (9 papers), Electromagnetic Simulation and Numerical Methods (7 papers), 3D IC and TSV technologies (4 papers), Electrostatic Discharge in Electronics (4 papers), Electromagnetic Scattering and Analysis (2 papers) and Electronic Packaging and Soldering Technologies (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (686 citations), Aerospace Engineering (243 citations), Astronomy and Astrophysics (54 citations), Electronic, Optical and Magnetic Materials (34 citations) and Hardware and Architecture (12 citations). D.M. Hockanson has collaborated with scholars based in United States and China. Frequent co-authors include James L. Drewniak, T.H. Hubing, T.P. Van Doren, Fei Sha, Michael J. Wilhelm, Xiaoning Ye, R.E. DuBroff, Kuang-Ping Ma, Marina Y. Koledintseva and Matteo Cocchini. Their work appears in journals such as IEEE Transactions on Electromagnetic Compatibility, Electromagnetic waves and IEEE Electromagnetic Compatibility Magazine.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.