Da‐Yuan Shih

41 papers and 1.8k indexed citations i.

About

Da‐Yuan Shih has authored 41 papers that have received a total of 1.8k indexed citations. This includes 38 papers in Electrical and Electronic Engineering, 23 papers in Mechanical Engineering and 6 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (22 papers) and Advanced Welding Techniques Analysis (11 papers). Da‐Yuan Shih is often cited by papers focused on Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (22 papers) and Advanced Welding Techniques Analysis (11 papers) and collaborates with scholars based in United States, South Korea and Canada. Da‐Yuan Shih's co-authors include Sung K. Kang, Paul Lauro, C. C. Goldsmith, Jin Yu and S. K. Kang and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and IEEE Transactions on Electron Devices.

In The Last Decade

Fields of papers published by Da‐Yuan Shih

Since Specialization
EngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics

Countries citing papers authored by Da‐Yuan Shih

Since Specialization
Citations
Rankless by CCL
2025