Dawn Wang
Impact in
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- Radio Frequency Integrated Circuit Design
- Electrostatic Discharge in Electronics
- Electromagnetic Compatibility and Noise Suppression
- Advancements in PLL and VCO Technologies
- Semiconductor materials and devices
- Advancements in Semiconductor Devices and Circuit Design
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- Heat Transfer and Boiling Studies
- Heat Transfer and Optimization
Papers in
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- Radio Frequency Integrated Circuit Design 16
- Electromagnetic Compatibility and Noise Suppression 6
- Electrostatic Discharge in Electronics 6
- Microwave Engineering and Waveguides 5
- Advancements in PLL and VCO Technologies 5
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- Surface Modification and Superhydrophobicity 4
- Co-authors
- Yau‐Ming Chen (3 shared papers)Shen‐Chun Wu (3 shared papers)Alvin Joseph (7 shared papers)Albert Wang (4 shared papers)Fei Lu (4 shared papers)Mau-Chung Frank Chang (1 shared paper)Zitao Shi (1 shared paper)Xin Wang (1 shared paper)
- Journals
- IEEE Journal of Solid-State Circuits (2 papers)Applied Thermal Engineering (1 paper)IEEE Microwave and Wireless Components Letters (1 paper)International Journal of Thermal Sciences (1 paper)International Journal of Heat and Mass Transfer (1 paper)
- Partner nations
- United StatesChinaTaiwan
In The Last Decade
Dawn Wang
27 papers receiving 313 citations
Peers
Comparison fields: 5 of 28
- Electrical and Electronic Engineering 214
- Mechanical Engineering 108
- Computational Mechanics 35
- Surfaces, Coatings and Films 9
- Aerospace Engineering 30
Countries citing papers authored by Dawn Wang
This map shows the geographic impact of Dawn Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Dawn Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Dawn Wang more than expected).
Fields of papers citing papers by Dawn Wang
This network shows the impact of papers produced by Dawn Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Dawn Wang. The network helps show where Dawn Wang may publish in the future.
Co-authors
The 25 scholars most cited alongside Dawn Wang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 27 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2014 | 63 | |
| 2 | 2015 | 54 | |
| 3 | 2015 | 37 | |
| 4 | 2017 | 28 | |
| 5 | 2010 | 27 | |
| 6 | 2014 | 25 | |
| 7 | 2003 | 18 | |
| 8 | 2009 | 16 | |
| 9 | 2008 | 10 | |
| 10 | 2010 | 9 | |
| 11 | 2018 | 7 | |
| 12 | 2006 | 5 | |
| 13 | 2017 | 5 | |
| 14 | 2018 | 4 | |
| 15 | 2013 | 4 | |
| 16 | 2013 | 3 | |
| 17 | 2005 | 3 | |
| 18 | 2011 | 3 | |
| 19 | 2013 | 2 | |
| 20 | 2013 | 2 |
About Dawn Wang
Dawn Wang is a scholar working on Electrical and Electronic Engineering, Surfaces, Coatings and Films, Mechanical Engineering, Computational Mechanics and Mechanics of Materials, having authored 27 papers that have together received 335 indexed citations. Recurring topics across this work include Radio Frequency Integrated Circuit Design (16 papers), Electromagnetic Compatibility and Noise Suppression (6 papers), Electrostatic Discharge in Electronics (6 papers), Microwave Engineering and Waveguides (5 papers), Advancements in PLL and VCO Technologies (5 papers), Heat Transfer and Optimization (4 papers), Heat Transfer and Boiling Studies (4 papers) and Surface Modification and Superhydrophobicity (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (214 citations), Mechanical Engineering (108 citations), Computational Mechanics (35 citations), Surfaces, Coatings and Films (9 citations) and Aerospace Engineering (30 citations). Dawn Wang has collaborated with scholars based in United States, China and Taiwan. Frequent co-authors include Yau‐Ming Chen, Shen‐Chun Wu, Alvin Joseph, Albert Wang, Fei Lu, Mau-Chung Frank Chang, Zitao Shi, Xin Wang, Xudong Wang and C. Patrick Yue. Their work appears in journals such as IEEE Journal of Solid-State Circuits, Applied Thermal Engineering, IEEE Microwave and Wireless Components Letters, International Journal of Thermal Sciences and International Journal of Heat and Mass Transfer.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.