Dae-Up Kim
About
Dae-Up Kim has authored 31 papers that have received a total of 343 indexed citations.
This includes 18 papers in Mechanical Engineering, 7 papers in Electrical and Electronic Engineering and 5 papers in Materials Chemistry. The topics of these papers are Intermetallics and Advanced Alloy Properties (7 papers), Electronic Packaging and Soldering Technologies (5 papers) and High Temperature Alloys and Creep (5 papers). Dae-Up Kim is often cited by papers focused on Intermetallics and Advanced Alloy Properties (7 papers), Electronic Packaging and Soldering Technologies (5 papers) and High Temperature Alloys and Creep (5 papers) and collaborates with scholars based in South Korea and Japan. Dae-Up Kim's co-authors include Seung‐Boo Jung, Kazuyoshi Saida, Kazutoshi Nishimoto, Ja‐Myeong Koo and Yun-Mo Yeon and has published in prestigious journals such as Journal of Materials Science, Japanese Journal of Applied Physics and Materials.
In The Last Decade
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