D. Tsai
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
- Electrostatic Discharge in Electronics
- Semiconductor materials and devices
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- Electrical Contact Performance and Analysis
Papers in
- Surgery 1
- Surgical Simulation and Training 1
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- Artificial Intelligence in Healthcare and Education 1
- Co-authors
- Shuang Yang (1 shared paper)Michael Pecht (1 shared paper)Axel Krieger (1 shared paper)Chelsea Finn (1 shared paper)Jaepyeong Cha (1 shared paper)Brandon M. White (1 shared paper)Jeffrey K. Jopling (1 shared paper)Anton Deguet (1 shared paper)
- Journals
- IEEE Transactions on Components and Packaging Technologies (1 paper)Science Robotics (1 paper)
- Partner nations
- United States
In The Last Decade
D. Tsai
2 papers receiving 19 citations
Peers
Comparison fields: 5 of 11
- Electrical and Electronic Engineering 11
- Mechanical Engineering 7
- Hardware and Architecture 1
- Mechanics of Materials 3
- Biomedical Engineering 4
Countries citing papers authored by D. Tsai
This map shows the geographic impact of D. Tsai's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D. Tsai with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D. Tsai more than expected).
Fields of papers citing papers by D. Tsai
This network shows the impact of papers produced by D. Tsai. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D. Tsai. The network helps show where D. Tsai may publish in the future.
Co-authors
The 9 scholars most cited alongside D. Tsai, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
About D. Tsai
D. Tsai is a scholar working on Surgery, Health Informatics, Electrical and Electronic Engineering, Biomedical Engineering and Industrial and Manufacturing Engineering, having authored 2 papers that have together received 19 indexed citations. Recurring topics across this work include Soft Robotics and Applications (1 paper), Artificial Intelligence in Healthcare and Education (1 paper), Flexible and Reconfigurable Manufacturing Systems (1 paper), Surgical Simulation and Training (1 paper), 3D IC and TSV technologies (1 paper) and Electronic Packaging and Soldering Technologies (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (11 citations), Mechanical Engineering (7 citations), Hardware and Architecture (1 citation), Mechanics of Materials (3 citations) and Biomedical Engineering (4 citations). D. Tsai has collaborated with scholars based in United States. Frequent co-authors include Shuang Yang, Michael Pecht, Axel Krieger, Chelsea Finn, Jaepyeong Cha, Brandon M. White, Jeffrey K. Jopling, Anton Deguet and Ji Woong Kim. Their work appears in journals such as IEEE Transactions on Components and Packaging Technologies and Science Robotics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.