D. Tsai
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electrostatic Discharge in Electronics
- Electromagnetic Compatibility and Noise Suppression
- Semiconductor materials and devices
Papers in
- Surgery 1
- Surgical Simulation and Training 1
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- Artificial Intelligence in Healthcare and Education 1
- Co-authors
- Michael Pecht (1 shared paper)Shuang Yang (1 shared paper)Chelsea Finn (1 shared paper)Jaepyeong Cha (1 shared paper)Anton Deguet (1 shared paper)Brandon M. White (1 shared paper)Axel Krieger (1 shared paper)Jeffrey K. Jopling (1 shared paper)
- Journals
- Science Robotics (1 paper)IEEE Transactions on Components and Packaging Technologies (1 paper)
- Partner nations
- United States
In The Last Decade
D. Tsai
2 papers receiving 26 citations
Peers
Comparison fields: 5 of 13
- Health Informatics 1
- Electrical and Electronic Engineering 12
- Mechanical Engineering 7
- Hardware and Architecture 1
- Biomedical Engineering 6
Countries citing papers authored by D. Tsai
This map shows the geographic impact of D. Tsai's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D. Tsai with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D. Tsai more than expected).
Fields of papers citing papers by D. Tsai
This network shows the impact of papers produced by D. Tsai. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D. Tsai. The network helps show where D. Tsai may publish in the future.
Co-authors
The 10 scholars most cited alongside D. Tsai, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
About D. Tsai
D. Tsai is a scholar working on Surgery, Health Informatics, Electrical and Electronic Engineering, Biomedical Engineering and Industrial and Manufacturing Engineering, having authored 2 papers that have together received 26 indexed citations. Recurring topics across this work include Artificial Intelligence in Healthcare and Education (1 paper), Electronic Packaging and Soldering Technologies (1 paper), Surgical Simulation and Training (1 paper), Soft Robotics and Applications (1 paper), 3D IC and TSV technologies (1 paper) and Flexible and Reconfigurable Manufacturing Systems (1 paper). The work is most often cited by research in Health Informatics (1 citation), Electrical and Electronic Engineering (12 citations), Mechanical Engineering (7 citations), Hardware and Architecture (1 citation) and Biomedical Engineering (6 citations). D. Tsai has collaborated with scholars based in United States. Frequent co-authors include Michael Pecht, Shuang Yang, Chelsea Finn, Jaepyeong Cha, Anton Deguet, Brandon M. White, Axel Krieger, Jeffrey K. Jopling, Ji Woong Kim and Samuel Schmidgall. Their work appears in journals such as Science Robotics and IEEE Transactions on Components and Packaging Technologies.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.