C.J. Hang

8 papers and 244 indexed citations i.

C.J. Hang is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, C.J. Hang has authored 8 papers receiving a total of 244 indexed citations (citations by other indexed papers that have themselves been cited), including 7 papers in Electrical and Electronic Engineering, 3 papers in Mechanical Engineering and 2 papers in Mechanics of Materials. Recurrent topics in C.J. Hang’s work include Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (4 papers) and Integrated Circuits and Semiconductor Failure Analysis (2 papers). C.J. Hang is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (4 papers) and Integrated Circuits and Semiconductor Failure Analysis (2 papers). C.J. Hang collaborates with scholars based in China, Canada and Qatar. C.J. Hang's co-authors include M. Mayer, Y. Zhou, Chunqing Wang, I. Lum and Yanhong Tian and has published in prestigious journals such as Advanced Materials, Journal of Electronic Materials and Microelectronic Engineering.