Chris Chang
Impact in
- Metals and Alloys top 10%
-
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
Papers in
-
- Electronic Packaging and Soldering Technologies 19
- 3D IC and TSV technologies 18
- Electromagnetic Compatibility and Noise Suppression 5
- Advanced Memory and Neural Computing 2
-
- Aluminum Alloys Composites Properties 6
- Non-Destructive Testing Techniques 2
- Co-authors
- John H. Lau (20 shared papers)S. W. Ricky Lee (4 shared papers)F. Mansfeld (1 shared paper)H. Shih (1 shared paper)Yuelong Huang (1 shared paper)J. E. Daugherty (1 shared paper)Chih‐Chiang Chen (1 shared paper)S. Erasmus (1 shared paper)
- Journals
- Journal of Electronic Packaging (4 papers)International Journal of Pediatric Otorhinolaryngology (1 paper)Corrosion Science (1 paper)AIP Advances (1 paper)Journal of Electronics Manufacturing (6 papers)
- Partner nations
- United StatesGermanyHong Kong
In The Last Decade
Chris Chang
30 papers receiving 418 citations
Peers
Comparison fields: 5 of 83
- Metals and Alloys 22
- Electrical and Electronic Engineering 274
- Mechanical Engineering 136
- Civil and Structural Engineering 71
- Materials Chemistry 139
Countries citing papers authored by Chris Chang
This map shows the geographic impact of Chris Chang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chris Chang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chris Chang more than expected).
Fields of papers citing papers by Chris Chang
This network shows the impact of papers produced by Chris Chang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chris Chang. The network helps show where Chris Chang may publish in the future.
Co-authors
The 17 scholars most cited alongside Chris Chang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 30 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2008 | 140 | |
| 2 | 2000 | 49 | |
| 3 | 2002 | 48 | |
| 4 | 2000 | 36 | |
| 5 | 2012 | 33 | |
| 6 | 2002 | 25 | |
| 7 | How to select underfill materials for solder bumped flip chips on low cost substrates | 1998 | 21 |
| 8 | 2002 | 17 | |
| 9 | 1999 | 15 | |
| 10 | 1985 | 13 | |
| 11 | Nonlinear fracture mechanics analysis of wafer level chip scale package solder joints with cracks | 2000 | 12 |
| 12 | 1998 | 12 | |
| 13 | 1997 | 12 | |
| 14 | Characteristics and Reliability of No-Flow Underfills for Solder Bumped Flip Chip Assemblies | 1999 | 7 |
| 15 | 2022 | 7 | |
| 16 | 2006 | 7 | |
| 17 | 2000 | 6 | |
| 18 | 2000 | 5 | |
| 19 | 2000 | 5 | |
| 20 | 1998 | 4 |
About Chris Chang
Chris Chang is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Civil and Structural Engineering, Mechanics of Materials and Building and Construction, having authored 30 papers that have together received 496 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (19 papers), 3D IC and TSV technologies (18 papers), Aluminum Alloys Composites Properties (6 papers), Electromagnetic Compatibility and Noise Suppression (5 papers), Infrastructure Maintenance and Monitoring (2 papers), Advanced Memory and Neural Computing (2 papers), Non-Destructive Testing Techniques (2 papers) and Synthesis and properties of polymers (1 paper). The work is most often cited by research in Metals and Alloys (22 citations), Electrical and Electronic Engineering (274 citations), Mechanical Engineering (136 citations), Civil and Structural Engineering (71 citations) and Materials Chemistry (139 citations). Chris Chang has collaborated with scholars based in United States, Germany and Hong Kong. Frequent co-authors include John H. Lau, S. W. Ricky Lee, F. Mansfeld, H. Shih, Yuelong Huang, J. E. Daugherty, Chih‐Chiang Chen, S. Erasmus, Thomas Rendall and David Cheng. Their work appears in journals such as Journal of Electronic Packaging, International Journal of Pediatric Otorhinolaryngology, Corrosion Science, AIP Advances and Journal of Electronics Manufacturing.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.