Chengqiang Cui
About
Chengqiang Cui has authored 48 papers that have received a total of 483 indexed citations.
This includes 29 papers in Electrical and Electronic Engineering, 15 papers in Materials Chemistry and 11 papers in Mechanical Engineering. The topics of these papers are Nanomaterials and Printing Technologies (12 papers), Electronic Packaging and Soldering Technologies (12 papers) and 3D IC and TSV technologies (7 papers). Chengqiang Cui is often cited by papers focused on Nanomaterials and Printing Technologies (12 papers), Electronic Packaging and Soldering Technologies (12 papers) and 3D IC and TSV technologies (7 papers) and collaborates with scholars based in China, Hong Kong and United States. Chengqiang Cui's co-authors include Jiye Luo, Guannan Yang and Jian Gao and has published in prestigious journals such as Advanced Functional Materials, Journal of The Electrochemical Society and ACS Applied Materials & Interfaces.
In The Last Decade
Fields of papers published by Chengqiang Cui
Since SpecializationEngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics
Countries citing papers authored by Chengqiang Cui
Since SpecializationCitations
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