C.C. Lee
Impact in
- Condensed Matter Physics top 5%
- GaN-based semiconductor devices and materials
- General Materials Science top 2%
Papers in
-
- Electronic Packaging and Soldering Technologies 22
- 3D IC and TSV technologies 21
- Photonic and Optical Devices 6
- Semiconductor Lasers and Optical Devices 4
- Electromagnetic Compatibility and Noise Suppression 4
- Co-authors
- G. Matijasevic (4 shared papers)Ricky W. Chuang (4 shared papers)Jeong Park (4 shared papers)W.W. So (4 shared papers)Jungjae Park (2 shared papers)C.S. Tsai (6 shared papers)Moo Whan Shin (1 shared paper)Daewon Kim (3 shared papers)
- Journals
- IEEE Transactions on Components and Packaging Technologies (3 papers)Journal of Lightwave Technology (2 papers)IEEE Photonics Technology Letters (2 papers)IEEE Electron Device Letters (2 papers)Journal of Materials Research and Technology (1 paper)
- Partner nations
- United StatesTaiwanSouth Korea
In The Last Decade
C.C. Lee
42 papers receiving 871 citations
Peers
Comparison fields: 5 of 54
- Condensed Matter Physics 190
- General Materials Science 47
- Electrical and Electronic Engineering 773
- Atomic and Molecular Physics, and Optics 189
- Mechanical Engineering 210
Countries citing papers authored by C.C. Lee
This map shows the geographic impact of C.C. Lee's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C.C. Lee with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C.C. Lee more than expected).
Fields of papers citing papers by C.C. Lee
This network shows the impact of papers produced by C.C. Lee. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C.C. Lee. The network helps show where C.C. Lee may publish in the future.
Co-authors
The 25 scholars most cited alongside C.C. Lee, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 44 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1991 | 115 | |
| 2 | 1993 | 106 | |
| 3 | 2002 | 101 | |
| 4 | 2005 | 58 | |
| 5 | 1997 | 56 | |
| 6 | 2004 | 52 | |
| 7 | 2003 | 45 | |
| 8 | 2004 | 43 | |
| 9 | 2000 | 43 | |
| 10 | 1999 | 43 | |
| 11 | 2006 | 29 | |
| 12 | 1985 | 29 | |
| 13 | 1988 | 26 | |
| 14 | 1989 | 24 | |
| 15 | 2004 | 21 | |
| 16 | 1992 | 19 | |
| 17 | 2005 | 16 | |
| 18 | 1993 | 9 | |
| 19 | 2002 | 7 | |
| 20 | 1990 | 7 |
About C.C. Lee
C.C. Lee is a scholar working on Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics, Mechanical Engineering, Mechanics of Materials and Biomedical Engineering, having authored 44 papers that have together received 926 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (22 papers), 3D IC and TSV technologies (21 papers), Photonic and Optical Devices (6 papers), Advanced Welding Techniques Analysis (5 papers), GaN-based semiconductor devices and materials (5 papers), Semiconductor Lasers and Optical Devices (4 papers), Adhesion, Friction, and Surface Interactions (4 papers) and Electromagnetic Compatibility and Noise Suppression (4 papers). The work is most often cited by research in Condensed Matter Physics (190 citations), General Materials Science (47 citations), Electrical and Electronic Engineering (773 citations), Atomic and Molecular Physics, and Optics (189 citations) and Mechanical Engineering (210 citations). C.C. Lee has collaborated with scholars based in United States, Taiwan and South Korea. Frequent co-authors include G. Matijasevic, Ricky W. Chuang, Jeong Park, W.W. So, Jungjae Park, C.S. Tsai, Moo Whan Shin, Daewon Kim, Jun Su and Moo Whan Shin. Their work appears in journals such as IEEE Transactions on Components and Packaging Technologies, Journal of Lightwave Technology, IEEE Photonics Technology Letters, IEEE Electron Device Letters and Journal of Materials Research and Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.