Boping Wu
Impact in
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- Electromagnetic Compatibility and Noise Suppression
- 3D IC and TSV technologies
- Microwave Engineering and Waveguides
- Electromagnetic Simulation and Numerical Methods
- Semiconductor Lasers and Optical Devices
- Electronic Packaging and Soldering Technologies
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- Electromagnetic Scattering and Analysis
Papers in
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- 3D IC and TSV technologies 15
- Electromagnetic Compatibility and Noise Suppression 10
- Semiconductor Lasers and Optical Devices 5
- Electromagnetic Simulation and Numerical Methods 4
- Microwave and Dielectric Measurement Techniques 2
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- Electromagnetic Scattering and Analysis 11
- Co-authors
- Leung Tsang (13 shared papers)Xiaoxiong Gu (6 shared papers)Mark B. Ritter (3 shared papers)Christian W. Baks (3 shared papers)R. John (2 shared papers)John F. Bulzacchelli (1 shared paper)Dong Gun Kam (2 shared papers)Renato Rímolo-Donadío (2 shared papers)
- Journals
- IEEE Transactions on Advanced Packaging (3 papers)Electromagnetic waves (2 papers)Microwave and Optical Technology Letters (2 papers)IEEE Antennas and Wireless Propagation Letters (2 papers)IEEE Microwave and Wireless Components Letters (1 paper)
- Partner nations
- United StatesChinaGermany
In The Last Decade
Boping Wu
32 papers receiving 350 citations
Peers
Comparison fields: 5 of 17
- Electrical and Electronic Engineering 278
- Atomic and Molecular Physics, and Optics 122
- Electronic, Optical and Magnetic Materials 15
- Hardware and Architecture 7
- Computer Networks and Communications 16
Countries citing papers authored by Boping Wu
This map shows the geographic impact of Boping Wu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Boping Wu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Boping Wu more than expected).
Fields of papers citing papers by Boping Wu
This network shows the impact of papers produced by Boping Wu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Boping Wu. The network helps show where Boping Wu may publish in the future.
Co-authors
The 22 scholars most cited alongside Boping Wu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 35 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2009 | 67 | |
| 2 | 2009 | 37 | |
| 3 | 2009 | 36 | |
| 4 | 2009 | 34 | |
| 5 | 2008 | 26 | |
| 6 | 2008 | 25 | |
| 7 | 2007 | 21 | |
| 8 | 2011 | 21 | |
| 9 | 2012 | 19 | |
| 10 | 2010 | 18 | |
| 11 | 2007 | 9 | |
| 12 | 2009 | 6 | |
| 13 | 2009 | 5 | |
| 14 | 2012 | 5 | |
| 15 | 2008 | 4 | |
| 16 | 2014 | 4 | |
| 17 | Method to Reduce Coupon Length for S-parameter Measurements | 2015 | 4 |
| 18 | 2008 | 3 | |
| 19 | 2010 | 3 | |
| 20 | 2016 | 2 |
About Boping Wu
Boping Wu is a scholar working on Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics, Electronic, Optical and Magnetic Materials, Computer Networks and Communications and Computational Mechanics, having authored 35 papers that have together received 366 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (15 papers), Electromagnetic Scattering and Analysis (11 papers), Electromagnetic Compatibility and Noise Suppression (10 papers), Semiconductor Lasers and Optical Devices (5 papers), Electromagnetic Simulation and Numerical Methods (4 papers), Metamaterials and Metasurfaces Applications (2 papers), Interconnection Networks and Systems (2 papers) and Microwave and Dielectric Measurement Techniques (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (278 citations), Atomic and Molecular Physics, and Optics (122 citations), Electronic, Optical and Magnetic Materials (15 citations), Hardware and Architecture (7 citations) and Computer Networks and Communications (16 citations). Boping Wu has collaborated with scholars based in United States, China and Germany. Frequent co-authors include Leung Tsang, Xiaoxiong Gu, Mark B. Ritter, Christian W. Baks, R. John, John F. Bulzacchelli, Dong Gun Kam, Renato Rímolo-Donadío, Christian Schuster and M. Ritter. Their work appears in journals such as IEEE Transactions on Advanced Packaging, Electromagnetic waves, Microwave and Optical Technology Letters, IEEE Antennas and Wireless Propagation Letters and IEEE Microwave and Wireless Components Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.