Abdullah Aziz Saad
About
Abdullah Aziz Saad has authored 33 papers that have received a total of 346 indexed citations.
This includes 19 papers in Mechanical Engineering, 14 papers in Electrical and Electronic Engineering and 14 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (8 papers) and High Temperature Alloys and Creep (6 papers). Abdullah Aziz Saad is often cited by papers focused on Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (8 papers) and High Temperature Alloys and Creep (6 papers) and collaborates with scholars based in Malaysia, United Kingdom and China. Abdullah Aziz Saad's co-authors include Fakhrozi Che Ani, Wei Sun, M.Z. Abdullah, T.H. Hyde and Aizat Abas and has published in prestigious journals such as The Journal of the Acoustical Society of America, International Journal of Heat and Mass Transfer and International Journal of Mechanical Sciences.
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