IEEE Transactions on Advanced Packaging

1.0k papers and 17.4k indexed citations i.

The 1.0k papers published in IEEE Transactions on Advanced Packaging in the last decades have received a total of 17.4k indexed citations. Papers published in IEEE Transactions on Advanced Packaging usually cover Electrical and Electronic Engineering (919 papers), Mechanical Engineering (114 papers) and Mechanics of Materials (106 papers) specifically the topics of 3D IC and TSV technologies (341 papers), Electromagnetic Compatibility and Noise Suppression (334 papers) and Electronic Packaging and Soldering Technologies (311 papers). The most active scholars publishing in IEEE Transactions on Advanced Packaging are M. Nakhla, Madhavan Swaminathan, Joungho Kim, Ruey‐Beei Wu and Manos M. Tentzeris.