Y. L. Lin
About
Y. L. Lin has authored 24 papers that have received a total of 718 indexed citations.
This includes 16 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 4 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (13 papers) and Intermetallics and Advanced Alloy Properties (5 papers). Y. L. Lin is often cited by papers focused on Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (13 papers) and Intermetallics and Advanced Alloy Properties (5 papers) and collaborates with scholars based in Taiwan, China and United States. Y. L. Lin's co-authors include C. R. Kao, Cheng–En Ho, Cheng‐Hsien Tsai, Jang‐Zern Tsai and Yi‐Shao Lai and has published in prestigious journals such as Chemistry of Materials, Materials Science and Engineering A and Expert Systems with Applications.
In The Last Decade
Fields of papers published by Y. L. Lin
Since SpecializationEngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics
Countries citing papers authored by Y. L. Lin
Since SpecializationCitations
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