W. Hügel

20 papers and 486 indexed citations i.

About

W. Hügel has authored 20 papers that have received a total of 486 indexed citations. This includes 15 papers in Electrical and Electronic Engineering, 8 papers in Atomic and Molecular Physics, and Optics and 7 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (12 papers), Semiconductor Quantum Structures and Devices (5 papers) and Intermetallics and Advanced Alloy Properties (4 papers). W. Hügel is often cited by papers focused on Electronic Packaging and Soldering Technologies (12 papers), Semiconductor Quantum Structures and Devices (5 papers) and Intermetallics and Advanced Alloy Properties (4 papers) and collaborates with scholars based in Germany, United States and France. W. Hügel's co-authors include Andreas Leineweber, E. J. Mittemeijer, Christian Wieser, U. Welzel and Rainer Niewa and has published in prestigious journals such as Physical Review Letters, Applied Physics Letters and Corrosion Science.

In The Last Decade

Fields of papers published by W. Hügel

Since Specialization
EngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics

Countries citing papers authored by W. Hügel

Since Specialization
Citations
Rankless by CCL
2025