W. Hügel

20 papers and 482 indexed citations i.

W. Hügel has authored 20 papers that have received a total of 482 indexed citations. This includes 15 papers in Electrical and Electronic Engineering, 8 papers in Atomic and Molecular Physics, and Optics and 7 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (12 papers), Semiconductor Quantum Structures and Devices (5 papers) and Intermetallics and Advanced Alloy Properties (4 papers). W. Hügel is often cited by papers focused on Electronic Packaging and Soldering Technologies (12 papers), Semiconductor Quantum Structures and Devices (5 papers) and Intermetallics and Advanced Alloy Properties (4 papers) and collaborates with scholars based in Germany, United States and France. W. Hügel's co-authors include E. J. Mittemeijer, U. Welzel, Martin Wegener, H. Haug and Andreas Leineweber and has published in prestigious journals such as Physical Review Letters, Applied Physics Letters and Corrosion Science.