Tom Ritzdorf
Impact in
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- Copper Interconnects and Reliability
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- Electronic Packaging and Soldering Technologies
- Electrodeposition and Electroless Coatings
- 3D IC and TSV technologies
- Semiconductor materials and devices
Papers in
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- Electrodeposition and Electroless Coatings 12
- Electronic Packaging and Soldering Technologies 11
- 3D IC and TSV technologies 9
- Semiconductor materials and devices 4
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- Copper Interconnects and Reliability 13
- Co-authors
- Rozalia Beica (2 shared papers)Kazuyoshi Ueno (2 shared papers)Paul R. McHugh (3 shared papers)Gregory J. Wilson (2 shared papers)G. Ritter (1 shared paper)L. J. Graham (3 shared papers)David B. Fraser (1 shared paper)K. M. Hanson (1 shared paper)
- Journals
- Journal of The Electrochemical Society (5 papers)Solid-State Electronics (1 paper)IBM Journal of Research and Development (1 paper)Journal of Applied Physics (1 paper)ECS Transactions (3 papers)
- Partner nations
- United StatesJapan
In The Last Decade
Tom Ritzdorf
21 papers receiving 405 citations
Peers
Comparison fields: 5 of 30
- Electronic, Optical and Magnetic Materials 148
- Electrical and Electronic Engineering 408
- Electrochemistry 30
- Automotive Engineering 48
- General Materials Science 9
Countries citing papers authored by Tom Ritzdorf
This map shows the geographic impact of Tom Ritzdorf's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tom Ritzdorf with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tom Ritzdorf more than expected).
Fields of papers citing papers by Tom Ritzdorf
This network shows the impact of papers produced by Tom Ritzdorf. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tom Ritzdorf. The network helps show where Tom Ritzdorf may publish in the future.
Co-authors
The 20 scholars most cited alongside Tom Ritzdorf, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 24 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2008 | 103 | |
| 2 | 2006 | 66 | |
| 3 | 1999 | 50 | |
| 4 | 2003 | 29 | |
| 5 | 2002 | 26 | |
| 6 | 2007 | 24 | |
| 7 | 2008 | 22 | |
| 8 | 2000 | 22 | |
| 9 | 2002 | 19 | |
| 10 | 1998 | 18 | |
| 11 | 2006 | 16 | |
| 12 | 2005 | 11 | |
| 13 | 2004 | 10 | |
| 14 | 1999 | 7 | |
| 15 | 2006 | 7 | |
| 16 | 1999 | 3 | |
| 17 | 2007 | 2 | |
| 18 | 2008 | 2 | |
| 19 | 2003 | 2 | |
| 20 | 2003 | 2 |
About Tom Ritzdorf
Tom Ritzdorf is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Atomic and Molecular Physics, and Optics, Mechanics of Materials and Materials Chemistry, having authored 24 papers that have together received 445 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (13 papers), Electrodeposition and Electroless Coatings (12 papers), Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (9 papers), Semiconductor materials and interfaces (5 papers), Semiconductor materials and devices (4 papers), Metal and Thin Film Mechanics (3 papers) and Anodic Oxide Films and Nanostructures (2 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (148 citations), Electrical and Electronic Engineering (408 citations), Electrochemistry (30 citations), Automotive Engineering (48 citations) and General Materials Science (9 citations). Tom Ritzdorf has collaborated with scholars based in United States and Japan. Frequent co-authors include Rozalia Beica, Kazuyoshi Ueno, Paul R. McHugh, Gregory J. Wilson, G. Ritter, L. J. Graham, David B. Fraser, K. M. Hanson, M. E. Gross and James Turner. Their work appears in journals such as Journal of The Electrochemical Society, Solid-State Electronics, IBM Journal of Research and Development, Journal of Applied Physics and ECS Transactions.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.