T. Nakamura
About
T. Nakamura has authored 105 papers that have received a total of 1.2k indexed citations.
This includes 85 papers in Electrical and Electronic Engineering, 33 papers in Electronic, Optical and Magnetic Materials and 23 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are Semiconductor materials and devices (45 papers), Copper Interconnects and Reliability (33 papers) and 3D IC and TSV technologies (26 papers). T. Nakamura is often cited by papers focused on Semiconductor materials and devices (45 papers), Copper Interconnects and Reliability (33 papers) and 3D IC and TSV technologies (26 papers) and collaborates with scholars based in Japan, United States and Taiwan. T. Nakamura's co-authors include Takayuki Ohba, Koji Fujimoto, Hideki Kitada, Takashi Suzuki and Akira Uedono and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society.
In The Last Decade
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