Siming Pan
Impact in
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- Electromagnetic Compatibility and Noise Suppression
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Electromagnetic Compatibility and Measurements
- Electrostatic Discharge in Electronics
- Microwave Engineering and Waveguides
Papers in
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- Electromagnetic Compatibility and Noise Suppression 21
- 3D IC and TSV technologies 17
- Electronic Packaging and Soldering Technologies 8
- Microwave Engineering and Waveguides 5
- Advanced DC-DC Converters 4
- Electrostatic Discharge in Electronics 4
- Microwave and Dielectric Measurement Techniques 4
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- Advanced Antenna and Metasurface Technologies 5
- Co-authors
- Jun Fan (25 shared papers)Brice Achkir (14 shared papers)Jingook Kim (7 shared papers)James L. Drewniak (5 shared papers)Fangliang Zheng (1 shared paper)Wenwen Zheng (1 shared paper)Meichen Liu (1 shared paper)Limei Li (1 shared paper)
- Journals
- IEEE Transactions on Electromagnetic Compatibility (5 papers)IEEE Transactions on Communications (2 papers)IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (1 paper)IEEE Journal of Emerging and Selected Topics in Power Electronics (1 paper)Food and Bioprocess Technology (1 paper)
- Partner nations
- United StatesChinaSouth Korea
In The Last Decade
Siming Pan
38 papers receiving 452 citations
Peers
Comparison fields: 5 of 56
- Electrical and Electronic Engineering 373
- Hardware and Architecture 20
- Biomaterials 36
- Biochemistry 13
- Aerospace Engineering 55
Countries citing papers authored by Siming Pan
This map shows the geographic impact of Siming Pan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Siming Pan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Siming Pan more than expected).
Fields of papers citing papers by Siming Pan
This network shows the impact of papers produced by Siming Pan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Siming Pan. The network helps show where Siming Pan may publish in the future.
Co-authors
The 25 scholars most cited alongside Siming Pan, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 39 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2017 | 78 | |
| 2 | 2013 | 44 | |
| 3 | 2019 | 33 | |
| 4 | 2012 | 30 | |
| 5 | 2011 | 30 | |
| 6 | 2016 | 30 | |
| 7 | 2010 | 29 | |
| 8 | 2019 | 22 | |
| 9 | 2009 | 15 | |
| 10 | 1985 | 15 | |
| 11 | 2017 | 14 | |
| 12 | 2017 | 14 | |
| 13 | 2013 | 11 | |
| 14 | 2010 | 10 | |
| 15 | 2013 | 9 | |
| 16 | 2010 | 7 | |
| 17 | 2014 | 7 | |
| 18 | 2012 | 7 | |
| 19 | Innovative PDN Design Guidelines for Practical High Layer-Count PCBs | 2013 | 7 |
| 20 | 2009 | 6 |
About Siming Pan
Siming Pan is a scholar working on Electrical and Electronic Engineering, Aerospace Engineering, Computer Networks and Communications, Control and Systems Engineering and Atomic and Molecular Physics, and Optics, having authored 39 papers that have together received 475 indexed citations. Recurring topics across this work include Electromagnetic Compatibility and Noise Suppression (21 papers), 3D IC and TSV technologies (17 papers), Electronic Packaging and Soldering Technologies (8 papers), Microwave Engineering and Waveguides (5 papers), Advanced Antenna and Metasurface Technologies (5 papers), Advanced DC-DC Converters (4 papers), Electrostatic Discharge in Electronics (4 papers) and Microwave and Dielectric Measurement Techniques (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (373 citations), Hardware and Architecture (20 citations), Biomaterials (36 citations), Biochemistry (13 citations) and Aerospace Engineering (55 citations). Siming Pan has collaborated with scholars based in United States, China and South Korea. Frequent co-authors include Jun Fan, Brice Achkir, Jingook Kim, James L. Drewniak, Fangliang Zheng, Wenwen Zheng, Meichen Liu, Limei Li, Bichen Chen and Hongsheng Liu. Their work appears in journals such as IEEE Transactions on Electromagnetic Compatibility, IEEE Transactions on Communications, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, IEEE Journal of Emerging and Selected Topics in Power Electronics and Food and Bioprocess Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.