Seung‐Boo Jung

411 papers and 8.2k indexed citations i.

About

Seung‐Boo Jung has authored 411 papers that have received a total of 8.2k indexed citations. This includes 319 papers in Electrical and Electronic Engineering, 226 papers in Mechanical Engineering and 51 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (274 papers), 3D IC and TSV technologies (213 papers) and Advanced Welding Techniques Analysis (134 papers). Seung‐Boo Jung is often cited by papers focused on Electronic Packaging and Soldering Technologies (274 papers), 3D IC and TSV technologies (213 papers) and Advanced Welding Techniques Analysis (134 papers) and collaborates with scholars based in South Korea, Australia and United States. Seung‐Boo Jung's co-authors include Jeong‐Won Yoon, Bo‐In Noh, Jong‐Woong Kim, Yun-Mo Yeon and Dae‐Gon Kim and has published in prestigious journals such as Journal of The Electrochemical Society, Scientific Reports and ACS Applied Materials & Interfaces.

In The Last Decade

Fields of papers published by Seung‐Boo Jung

Since Specialization
EngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics

Countries citing papers authored by Seung‐Boo Jung

Since Specialization
Citations
Rankless by CCL
2025