Robert L Terpstra

10 papers and 377 indexed citations i.

Robert L Terpstra has authored 10 papers that have received a total of 377 indexed citations. This includes 10 papers in Electrical and Electronic Engineering, 4 papers in Mechanical Engineering and 2 papers in Computational Mechanics. The topics of these papers are Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (4 papers) and Fluid Dynamics and Heat Transfer (2 papers). Robert L Terpstra is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (4 papers) and Fluid Dynamics and Heat Transfer (2 papers) and collaborates with scholars based in United States. Robert L Terpstra's co-authors include Iver E. Anderson, B. A. Cook, J. L. Harringa, J. C. Foley and Ö. Ünal and has published in prestigious journals such as Materials Science and Engineering A, JOM and Journal of Electronic Materials.