Qiang Zhou
About
Qiang Zhou has authored 37 papers that have received a total of 560 indexed citations.
This includes 18 papers in Mechanical Engineering, 12 papers in Aerospace Engineering and 11 papers in Electrical and Electronic Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (4 papers) and Aluminum Alloys Composites Properties (4 papers). Qiang Zhou is often cited by papers focused on Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (4 papers) and Aluminum Alloys Composites Properties (4 papers) and collaborates with scholars based in China, Czechia and Australia. Qiang Zhou's co-authors include Hongkun Li, Mingliang Huang, Ning Zhao, H.W. Zhang and Z.Y. Ma and has published in prestigious journals such as Materials Science and Engineering A, Journal of Materials Science and Applied Surface Science.
In The Last Decade
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