Pay Jun Liew

26 papers and 528 indexed citations i.

About

Pay Jun Liew is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Biomedical Engineering. According to data from OpenAlex, Pay Jun Liew has authored 26 papers receiving a total of 528 indexed citations (citations by other indexed papers that have themselves been cited), including 25 papers in Mechanical Engineering, 18 papers in Electrical and Electronic Engineering and 14 papers in Biomedical Engineering. Recurrent topics in Pay Jun Liew’s work include Advanced Machining and Optimization Techniques (18 papers), Advanced machining processes and optimization (17 papers) and Chemical Mechanical Polishing in Microelectronics Manufacturing (14 papers). Pay Jun Liew is often cited by papers focused on Advanced Machining and Optimization Techniques (18 papers), Advanced machining processes and optimization (17 papers) and Chemical Mechanical Polishing in Microelectronics Manufacturing (14 papers). Pay Jun Liew collaborates with scholars based in Malaysia, Japan and China. Pay Jun Liew's co-authors include Jiwang Yan, Tsunemoto Kuriyagawa, Keita Shimada, Tianfeng Zhou and Qumrul Ahsan and has published in prestigious journals such as International Journal of Heat and Mass Transfer, Applied Surface Science and Journal of Materials Processing Technology.

In The Last Decade

Fields of papers citing papers by Pay Jun Liew

Since Specialization
EngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics

This network shows the specialization of papers citing the papers produced by Pay Jun Liew. Nodes represent fields, and links connect fields that are likely to share authors. The network helps show where Pay Jun Liew may publish in the future.

Countries citing papers authored by Pay Jun Liew

Since Specialization
Citations

This map shows the geographic impact of Pay Jun Liew's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Pay Jun Liew with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Pay Jun Liew more than expected).

Rankless by CCL
2025