Paul T. Vianco
About
Paul T. Vianco has authored 97 papers that have received a total of 1.9k indexed citations.
This includes 81 papers in Electrical and Electronic Engineering, 63 papers in Mechanical Engineering and 25 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (76 papers), 3D IC and TSV technologies (25 papers) and Aluminum Alloy Microstructure Properties (23 papers). Paul T. Vianco is often cited by papers focused on Electronic Packaging and Soldering Technologies (76 papers), 3D IC and TSV technologies (25 papers) and Aluminum Alloy Microstructure Properties (23 papers) and collaborates with scholars based in United States, United Kingdom and Hong Kong. Paul T. Vianco's co-authors include Jerome A. Rejent, Jing Cheng, I. Artaki, Alice C. Kilgo and Paul F. Hlava and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Acta Materialia.
In The Last Decade
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