P.A. Brennan
About
P.A. Brennan has authored 7 papers that have received a total of 1.2k indexed citations.
This includes 7 papers in Electrical and Electronic Engineering, 1 paper in Biomedical Engineering and 1 paper in Atomic and Molecular Physics, and Optics. The topics of these papers are Electromagnetic Compatibility and Noise Suppression (5 papers), Electromagnetic Simulation and Numerical Methods (3 papers) and Electronic Packaging and Soldering Technologies (2 papers). P.A. Brennan is often cited by papers focused on Electromagnetic Compatibility and Noise Suppression (5 papers), Electromagnetic Simulation and Numerical Methods (3 papers) and Electronic Packaging and Soldering Technologies (2 papers) and collaborates with scholars based in United States. P.A. Brennan's co-authors include Albert E. Ruehli, A.E. Ruehli, Chung-Wen Ho and H. Guckel and has published in prestigious journals such as IEEE Transactions on Microwave Theory and Techniques, IEEE Journal of Solid-State Circuits and IBM Journal of Research and Development.
In The Last Decade
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