Michael Osterman

79 papers and 1.8k indexed citations i.

About

Michael Osterman has authored 79 papers that have received a total of 1.8k indexed citations. This includes 70 papers in Electrical and Electronic Engineering, 34 papers in Mechanical Engineering and 17 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (55 papers), 3D IC and TSV technologies (31 papers) and Advanced Welding Techniques Analysis (15 papers). Michael Osterman is often cited by papers focused on Electronic Packaging and Soldering Technologies (55 papers), 3D IC and TSV technologies (31 papers) and Advanced Welding Techniques Analysis (15 papers) and collaborates with scholars based in United States, Hong Kong and Japan. Michael Osterman's co-authors include Michael Pecht, Sony Mathew, Haiyu Qi, Michael H. Azarian and Mohammad Sarwar Alam and has published in prestigious journals such as Journal of Power Sources, Applied Surface Science and IEEE Access.

In The Last Decade

Fields of papers published by Michael Osterman

Since Specialization
EngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics

Countries citing papers authored by Michael Osterman

Since Specialization
Citations
Rankless by CCL
2025