Μ. Y. Tsai

95 papers and 2.4k indexed citations i.

About

Μ. Y. Tsai has authored 95 papers that have received a total of 2.4k indexed citations. This includes 52 papers in Electrical and Electronic Engineering, 38 papers in Mechanical Engineering and 36 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (30 papers), 3D IC and TSV technologies (28 papers) and Chemical Mechanical Polishing in Microelectronics Manufacturing (27 papers). Μ. Y. Tsai is often cited by papers focused on Electronic Packaging and Soldering Technologies (30 papers), 3D IC and TSV technologies (28 papers) and Chemical Mechanical Polishing in Microelectronics Manufacturing (27 papers) and collaborates with scholars based in Taiwan, United States and Hong Kong. Μ. Y. Tsai's co-authors include J. Morton, Chen‐Yu Huang, Gary L. Farley, Fu‐Tsai Kung and D. W. Oplinger and has published in prestigious journals such as JNCI Journal of the National Cancer Institute, Journal of Applied Mechanics and Human Reproduction.

In The Last Decade

Fields of papers published by Μ. Y. Tsai

Since Specialization
EngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics

Countries citing papers authored by Μ. Y. Tsai

Since Specialization
Citations
Rankless by CCL
2025