Lei Liu

162 papers and 3.4k indexed citations i.

Lei Liu has authored 162 papers that have received a total of 3.4k indexed citations. This includes 58 papers in Electrical and Electronic Engineering, 52 papers in Biomedical Engineering and 42 papers in Mechanical Engineering. The topics of these papers are Advanced Sensor and Energy Harvesting Materials (33 papers), Electronic Packaging and Soldering Technologies (16 papers) and 3D IC and TSV technologies (12 papers). Lei Liu is often cited by papers focused on Advanced Sensor and Energy Harvesting Materials (33 papers), Electronic Packaging and Soldering Technologies (16 papers) and 3D IC and TSV technologies (12 papers) and collaborates with scholars based in China, Canada and United States. Lei Liu's co-authors include Guisheng Zou, Y. Zhou, Wengan Wang, Bin Feng and Hui Ren and has published in prestigious journals such as Advanced Materials, Journal of Neuroscience and Applied Physics Letters.