Kong Boon Yeap
About
Kong Boon Yeap has authored 32 papers that have received a total of 307 indexed citations.
This includes 19 papers in Electrical and Electronic Engineering, 15 papers in Mechanics of Materials and 14 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Metal and Thin Film Mechanics (15 papers), Semiconductor materials and devices (14 papers) and Copper Interconnects and Reliability (13 papers). Kong Boon Yeap is often cited by papers focused on Metal and Thin Film Mechanics (15 papers), Semiconductor materials and devices (14 papers) and Copper Interconnects and Reliability (13 papers) and collaborates with scholars based in United States, Singapore and Germany. Kong Boon Yeap's co-authors include Kaiyang Zeng, Ehrenfried Zschech, Martin Gall, Patrick Justison and Zhongquan Liao and has published in prestigious journals such as Journal of Applied Physics, Acta Materialia and Materials Science and Engineering A.
In The Last Decade
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