J.W. Wan
About
J.W. Wan has authored 16 papers that have received a total of 367 indexed citations.
This includes 12 papers in Mechanical Engineering, 6 papers in Electrical and Electronic Engineering and 6 papers in Building and Construction. The topics of these papers are Electronic Packaging and Soldering Technologies (6 papers), Soft Robotics and Applications (4 papers) and Modular Robots and Swarm Intelligence (4 papers). J.W. Wan is often cited by papers focused on Electronic Packaging and Soldering Technologies (6 papers), Soft Robotics and Applications (4 papers) and Modular Robots and Swarm Intelligence (4 papers) and collaborates with scholars based in China, Canada and Singapore. J.W. Wan's co-authors include Wenjun Zhang, Donald J. Bergstrom, Sergi Astals, Shihu Hu and Yongchun Chen and has published in prestigious journals such as The Science of The Total Environment, Energy and Buildings and IEEE Access.
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