H. Y. Chuang

9 papers and 281 indexed citations i.

H. Y. Chuang has authored 9 papers that have received a total of 281 indexed citations. This includes 7 papers in Electrical and Electronic Engineering, 5 papers in Mechanical Engineering and 2 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (6 papers) and Advanced Welding Techniques Analysis (3 papers). H. Y. Chuang is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (6 papers) and Advanced Welding Techniques Analysis (3 papers) and collaborates with scholars based in Taiwan and Canada. H. Y. Chuang's co-authors include C. R. Kao, Jinran Yu, Jia-Hong Ke, Yan‐Cheng Lin and Hua-Ching Tong and has published in prestigious journals such as Journal of Applied Physics, Acta Materialia and Composites Science and Technology