H. Shimamoto
About
H. Shimamoto has authored 47 papers that have received a total of 262 indexed citations.
This includes 46 papers in Electrical and Electronic Engineering, 7 papers in Atomic and Molecular Physics, and Optics and 5 papers in Biomedical Engineering. The topics of these papers are 3D IC and TSV technologies (28 papers), Electronic Packaging and Soldering Technologies (16 papers) and Radio Frequency Integrated Circuit Design (11 papers). H. Shimamoto is often cited by papers focused on 3D IC and TSV technologies (28 papers), Electronic Packaging and Soldering Technologies (16 papers) and Radio Frequency Integrated Circuit Design (11 papers) and collaborates with scholars based in Japan, United Kingdom and United States. H. Shimamoto's co-authors include Katsuyoshi Washio, Katsuya Kikuchi, Naoya Watanabe, E. Ohue and M. Tanabe and has published in prestigious journals such as IEEE Transactions on Electron Devices, Japanese Journal of Applied Physics and Physics of Fluids.
In The Last Decade
Fields of papers published by H. Shimamoto
Since SpecializationEngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics
Countries citing papers authored by H. Shimamoto
Since SpecializationCitations
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