Guicui Fu

49 papers and 262 indexed citations i.

Guicui Fu has authored 49 papers that have received a total of 262 indexed citations. This includes 37 papers in Electrical and Electronic Engineering, 17 papers in Mechanical Engineering and 8 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (20 papers), Silicon Carbide Semiconductor Technologies (13 papers) and 3D IC and TSV technologies (8 papers). Guicui Fu is often cited by papers focused on Electronic Packaging and Soldering Technologies (20 papers), Silicon Carbide Semiconductor Technologies (13 papers) and 3D IC and TSV technologies (8 papers) and collaborates with scholars based in China, United Kingdom and Denmark. Guicui Fu's co-authors include Bo Wan, Yutai Su, Weifang Zhang, Xiaojun Yan and Wendi Guo and has published in prestigious journals such as Computer Methods in Applied Mechanics and Engineering, IEEE Transactions on Power Electronics and IEEE Access.