Guang Zeng

18 papers and 550 indexed citations i.

Guang Zeng has authored 18 papers that have received a total of 550 indexed citations. This includes 16 papers in Mechanical Engineering, 10 papers in Electrical and Electronic Engineering and 3 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (6 papers) and Intermetallics and Advanced Alloy Properties (4 papers). Guang Zeng is often cited by papers focused on Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (6 papers) and Intermetallics and Advanced Alloy Properties (4 papers) and collaborates with scholars based in China, Australia and Canada. Guang Zeng's co-authors include Zhong Sheng, Lili Gao, YU Sheng-lin, Songbai Xue and Yan Chen and has published in prestigious journals such as Journal of Alloys and Compounds, Journal of materials research/Pratt's guide to venture capital sources and Tribology International.